We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Plating Materials.
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Plating Materials Product List and Ranking from 4 Manufacturers, Suppliers and Companies

Plating Materials Product List

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Graphene Application Example: Ag-Graphene Composite Plating

Improved various characteristics through compounding! It is also possible to achieve both high conductivity and wear resistance.

Introducing "Ag-Graphene Composite Plating" utilizing graphene. By using our own manufactured graphene, we can reduce costs. Additionally, by not using antimony, we can decrease environmental impact. This can be used for applications such as hard silver plating alternatives and high-current connectors. For more details, please contact us. 【Features】 ■ Graphene composite in the plating film: Achieves high conductivity and wear resistance ■ Use of in-house manufactured graphene: Cost reduction ■ Use of cyan bath silver plating solution: Stable quality ■ No antimony used: Reduced environmental impact *For more details, please refer to the PDF document or feel free to contact us.

  • Company:FCM
  • Price:Other
  • others

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Green Chem Co., Ltd. Nanoparticle Plating Method Technology Introduction

An environmentally friendly plating method with fewer processes and simple operations.

Our company has developed a resource-saving, low environmental impact "nanoparticle plating method" for microbeads used in LCDs and other applications, which is easier to work with and achieves higher precision compared to conventional electroless plating methods. By applying our unique technology (patented), we have realized thin film formation with high adhesion. In conventional electroless plating methods, operators required advanced skills and experience, but the newly established nanoparticle plating method is an easy technology that does not require these. 【Features】 ■ Simple operation ■ Fewer processes ■ Resource-saving ■ Low environmental impact ■ Low manufacturing cost *For more details, please refer to the catalog or feel free to contact us.

  • Plating Equipment
  • Processing Contract

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High melting point solder plating material "DAIN TINGOOD 802"

Plating is possible with relatively high current efficiency! A stable Sb content (approximately 10 wt%) coating can be obtained.

"DAIN TINGOOD 802" is a Pb-free high melting point solder plating material. It is an acidic bath (organic sulfonic acid) that does not contain fluorides, allowing for a stable Sb content (approximately 10 wt%) coating to be obtained. Plating can be performed with relatively high current efficiency. 【Usage Conditions】 ■DAIN TINGOOD 802BASE  ・Concentration Condition: 900mL/L ■DAIN TINGOOD Sb-36  ・Concentration Condition: 11.5g/L ■DAIN TINGOOD S-25  ・Concentration Condition: 80g/L *For more details, please refer to the PDF document or feel free to contact us.

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  • Plating Equipment

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Technical Data: Difficulty of Soldering Based on Metal Material

Here is the technical data on the difficulty of soldering based on the type of metal.

At Kyushu Denka, we perform surface treatment of various metals and have established a research and development department to flexibly respond to advanced order requirements through multifaceted technical research. The specialized staff who work diligently in research here are an important presence that supports the company from a technical standpoint. We continue to challenge ourselves in pursuit of cutting-edge technology that leads the plating industry. [Contents] - Inorganic - Organic non-resin type - Resin type WW rosin / active rosin For more details, please contact us or download the catalog.

  • Surface treatment contract service

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